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19 January 2011 ,
Written by Dhruv Tanwar
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ARM and IBM have agreed to extend their collaboration on advanced semiconductor technologies to develop the next-gen mobile products optimized for performance and power efficiency. The resulting technology is expected to provide a suite of optimized physical and processor IP by ARM tuned to IBM’s advanced manufacturing process down to 14nm, which in turn would provide streamlined development and earlier introduction of advanced consumer electronics into the marketplace. Drives for this collaboration include enhanced consumer requirements for high-end features on mobile devices including extended battery life, always-on Internet access, high end multimedia and secure mobile transactions. ARM and IBM will collaborate to develop design platforms aligning the manufacturing process, microprocessor and physical IP design teams, in the bargain minimizing risks and barriers to migrating to smaller geometries. It will also help optimize density, performance, power and yield in advanced SoC designs. Collaborations between the two companies, specifically on advanced geometries dates back to 2008. In their previous collaboration on the 32nm and 28nm nodes, ARM delivered 11 test chips that provide concrete research structures and early silicon validation. |